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150-10-640-00-018101

150-10-640-00-018101

150-10-640-00-018101

Preci-Dip

Plug adapter, DIL 40 Gold-plated, 150-10-640-00-018101, Preci-Dip

SOT-23

150-10-640-00-018101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBRASS
Mount Through Hole
Mounting Type Through Hole
Insulation Material Polyamide
Housing Material POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
PackagingBulk
Published 2011
Series 150
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type DIP, DIL - Header
Color Black
Number of Rows 2
Additional FeatureSTANDARD: UL 94V-0
Contact Type Male Pin
Pitch 0.100 2.54mm
Orientation Straight
Current Rating1A
Contact Finish Gold
Number of Contacts 40
Row Spacing0.600 (15.24mm)
Number of Poles 40
Device Socket Type IC SOCKET
Length 50.6mm
Width 17.7mm
Contact Finish Thickness 10.0μin 0.25μm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1484 items

Pricing & Ordering

QuantityUnit PriceExt. Price
130$4.16262$541.1406

About 150-10-640-00-018101

The 150-10-640-00-018101 from Preci-Dip is a high-performance microcontroller designed for a wide range of embedded applications. This component features Plug adapter, DIL 40 Gold-plated, 150-10-640-00-018101, Preci-Dip.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 150-10-640-00-018101, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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