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5405

5405

5405

Pomona Electronics

CONN BIND POST DL FLUTD BLK/RED

SOT-23

5405 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Contact PlatingGold, Nickel
Weight 27.215542g
Material - Insulation Acrylonitrile Butadiene Styrene (ABS)
Mounting Style STRAIGHT
Material - Body Brass
Published 2000
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Threaded and Turret
ECCN Code EAR99
Type Standard, Dual
Color Black, Red
Additional FeatureMALE, ACRYLONITRILE BUTADIENE STYRENE
HTS Code8536.69.80.00
Subcategory RF Adapters
Voltage - Rated DC 2.5kV
Contact Finish - Mating AU
Current Rating15A
Reliability COMMERCIAL
Operating Temperature (Max) 50°C
Contact Style COAX
Body/Shell Style PLUG-PLUG
Plating - Body Gold
Head Style Fluted
Head Size 0.430 OD 11.00mm
Adapter Style BANANA-BINDING
Cross Hole Diameter 0.166 (4.22mm)
Height 12.7mm
Length 165.1mm
Width 101.6mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:350 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$20.69000$20.69
25$19.65560$491.39
50$18.62100$931.05
100$17.79350$1779.35

About 5405

The 5405 from Pomona Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BIND POST DL FLUTD BLK/RED.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5405, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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