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3049411

3049411

3049411

Phoenix Contact

CONN TERM BLK GROUND 14-26AWG

SOT-23

3049411 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Weight 30.449996g
Material - Insulation Polyamide (PA), Nylon
Published 2009
Series CLIPLINE RT
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Connector Type Screw
Type Ground, Earth
Number of Positions 2
Color Green, Yellow
Number of Rows 1
Voltage - Rated 1kV
Additional Feature94V-0, PA
HTS Code8536.69.40.40
Reach Compliance Code not_compliant
Current Rating24A
Termination Style Bolt and Nut
Approval Agency CB, UL, VDE
Number of Levels 1
Wire Gauge (Max) 26 AWG
Wire Gauge (Min) 14 AWG
Wire/Cable Gauge 14 AWG
Number of Decks 1
Wire Gauge or Range - AWG 14-26 AWG
Number of Ways 2
Safety Approval UL; VDE
Wire Gauge or Range - mm² 0.1-2.5mm2
Length 66mm
Width 12.3mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:922 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.82000$7.82
10$7.60500$76.05
50$7.10700$355.35
100$6.53850$653.85
250$6.04096$1510.24
500$5.75668$2878.34

About 3049411

The 3049411 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN TERM BLK GROUND 14-26AWG.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3049411, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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