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3046676

3046676

3046676

Phoenix Contact

DIN Rail Terminal Blocks UTTB 2,5-2DIO/O-UL DBL LEVEL 5.2MM

SOT-23

3046676 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Weight 800.136941g
Material - Insulation Polyamide (PA), Nylon
Published 2011
Series CLIPLINE UTTB
Feature Diode
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Type Feed Through
Number of Positions 4
Max Operating Temperature120°C
Color Gray
Voltage - Rated 500V
Current Rating28A
Termination Style Screw
Approval Agency CSA, cULus
Voltage 300V
Number of Levels 2; Connected
Current 500mA
Wire Gauge (Max) 26 AWG
Wire Gauge (Min) 12 AWG
Wire/Cable Gauge 12 AWG
Wire Gauge or Range - AWG 12-26 AWG
Voltage - IEC 500V
Wire Gauge or Range - mm² 0.14-4mm2
Current - IEC 24A
Stripping Length 9mm
Length 69.9mm
Width 5.2mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:798 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$9.32000$9.32
10$9.07000$90.7
50$8.47620$423.81
100$7.79810$779.81
250$7.20480$1801.2
500$6.86574$3432.87

About 3046676

The 3046676 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIN Rail Terminal Blocks UTTB 2,5-2DIO/O-UL DBL LEVEL 5.2MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3046676, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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