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3044681

3044681

3044681

Phoenix Contact

DIN Rail Terminal Blocks UTTB 2,5-L/N DBL LEVEL 5.2MM

SOT-23

3044681 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Through Hole
Weight 800.136941g
Material - Insulation Polyamide (PA), Nylon
Published 2010
Series CLIPLINE UTTB
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Type Feed Through
Number of Positions 4
Color Gray
Voltage - Rated 500V
Reach Compliance Code unknown
Current Rating24A
Termination Style Screw
Approval Agency CSA, UL
Voltage 600V
Number of Levels 2
Current 20A
Wire Gauge (Max) 26 AWG
Wire Gauge (Min) 12 AWG
Wire/Cable Gauge 12 AWG
Wire Gauge or Range - AWG 12-26 AWG
Voltage - IEC 500V
Wire Gauge or Range - mm² 0.14-4mm2
Current - IEC 24A
Stripping Length 9mm
Length 69.9mm
Width 5.2mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:2167 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.681800$7.6818
10$7.246981$72.46981
100$6.836775$683.6775
500$6.449787$3224.8935
1000$6.084705$6084.705

About 3044681

The 3044681 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIN Rail Terminal Blocks UTTB 2,5-L/N DBL LEVEL 5.2MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3044681, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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