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3037342

3037342

3037342

Phoenix Contact

DIN Rail Terminal Blocks ST 2.5-TWIN BK

SOT-23

3037342 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Through Hole
Weight 7.099996g
Material - Insulation Polyamide (PA), Nylon
Published 2010
Series CLIPLINE ST
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Type Feed Through
Number of Positions 3
Color Black
Voltage - Rated 800V
Reach Compliance Code unknown
Current Rating28A
Termination Style Push In, Spring
Approval Agency CB, CSA, UL, VDE
Voltage 600V
Number of Levels 1
Current 20A
Wire Gauge (Max) 28 AWG
Wire Gauge (Min) 12 AWG
Wire/Cable Gauge 12 AWG
Wire Gauge or Range - AWG 12-28 AWG
Voltage - IEC 800V
Wire Gauge or Range - mm² 0.08-4mm2
Current - IEC 24A
Stripping Length 10mm
Height 44mm
Length 60.5mm
Width 5.2mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:2579 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.32000$2.32
10$2.25700$22.57
50$2.10940$105.47
100$1.94060$194.06
250$1.79300$448.25
500$1.70862$854.31

About 3037342

The 3037342 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIN Rail Terminal Blocks ST 2.5-TWIN BK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3037342, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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