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2714022

2714022

2714022

Phoenix Contact

DIN Rail Terminal Blocks PIK 4-PE/L/L

SOT-23

2714022 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Weight 22.75001g
Material - Insulation Polyamide (PA), Nylon
Published 2006
Series CLIPLINE PIK
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Feed Through (2), Isolated
Number of Positions 5
Color Gray
Number of Rows 3
Voltage - Rated DC 400V
Current Rating34A
Termination Style Screw
Voltage - Rated AC 400V
Approval Agency UL
Lead Pitch 6.2mm
Number of Contacts 3
Voltage 300V
Number of Levels 3; 1 Grounded
Current 20A
Wire Gauge (Max) 28 AWG
Wire Gauge (Min) 12 AWG
Wire/Cable Gauge 24 AWG
Number of Decks 3
Wire Gauge or Range - AWG 12-28 AWG
Number of Ways 5
Safety Approval UL
Wire Gauge or Range - mm² 0.2-4mm2
Current - IEC 32A
Stripping Length 9mm
Wire Cross Section 4 mm2
Height 59mm
Length 88mm
Width 6.2mm
Material Flammability Rating UL94 V-2
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-2
In-Stock:3545 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$15.78500$789.25

About 2714022

The 2714022 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIN Rail Terminal Blocks PIK 4-PE/L/L.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2714022, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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