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1967760

1967760

1967760

Phoenix Contact

Socket enclosure - cable FK-MCP Total number of pins 10 Phoenix Contact 1967760 Contact spacing: 3.50 mm 50 pc(s)

SOT-23

1967760 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Contact PlatingTin
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Weight 8.580012g
PackagingBulk
Published 2011
Series COMBICON FK-MCP
Feature Positions Stamped
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Screwless
Connector Type Socket
Type Plug, Female Sockets
Number of Positions 10
Color Green
Voltage - Rated 160V
Pitch 0.138 3.50mm
Insulation Height 0.488 12.40mm
Current Rating8A
Termination Style Screwless - Push-In Spring
Number of Levels 1
Wire Gauge (Max) 28 AWG
Wire Gauge (Min) 16 AWG
Wire Gauge or Range - AWG 16-28 AWG
Plug Wire Entry 180°
Wire Gauge or Range - mm² 0.14-1.5mm2
Wire Strip Length 9mm
Height 20.8mm
Length 12.4mm
Width 35.9mm
RoHS StatusRoHS Compliant
In-Stock:433 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$16.83160$841.58

About 1967760

The 1967760 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Socket enclosure - cable FK-MCP Total number of pins 10 Phoenix Contact 1967760 Contact spacing: 3.50 mm 50 pc(s).

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1967760, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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