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1859768

1859768

1859768

Phoenix Contact

Pluggable Terminal Blocks 10 Pos 3.81mm pitch Through Hole Header

SOT-23

1859768 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
Weight 150.999993g
PackagingBulk
Published 2011
Series COMBICON MCD
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 20
Color Black
Number of Rows 2
Voltage - Rated 160V
Additional FeatureUL 94V-0, PBT
HTS Code8536.69.40.40
Pitch 0.150 3.81mm
Insulation Height 0.894 22.71mm
Current Rating8A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.138 3.50mm
Number of Levels 2
Current 8A
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 320V
Positions Per Level 10
Number of Ways 10
Safety Approval CSA; CUL; EAC; UL
Header Orientation 90°, Right Angle
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:682 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$11.67600$583.8

About 1859768

The 1859768 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 10 Pos 3.81mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1859768, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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