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1786514

1786514

1786514

Phoenix Contact

Conn Wire to Board RCP 13 POS 5.08mm Solder RA Thru-Hole

SOT-23

1786514 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 164.000007g
PackagingBulk
Published 2011
Series COMBICON IC
Feature Retention Latches
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Female Sockets
Number of Positions 13
Color Green
Number of Rows 1
Voltage - Rated 320V
Additional FeaturePA, 94V-0
HTS Code8536.69.40.40
Pitch 0.200 5.08mm
Insulation Height 0.402 10.20mm
Current Rating12A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.138 3.50mm
Number of Levels 1
Current 10A
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 630V
Number of Ways 13
Safety Approval UL
Header Orientation 90°, Right Angle
Current - IEC 12A
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:577 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$13.30360$665.18

About 1786514

The 1786514 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Wire to Board RCP 13 POS 5.08mm Solder RA Thru-Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1786514, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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