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1731743

1731743

1731743

Phoenix Contact

Pluggable Terminal Blocks 9 Pos 3.5mm pitch Through Hole Header

SOT-23

1731743 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
PackagingBulk
Published 2011
Series COMBICON MC
Feature Locking Ramp
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Header, Male Pins, Shrouded (4 Side)
Color Green
Number of Rows 1
Voltage - Rated 160V
Pitch 0.138 3.50mm
Current Rating8A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.134 3.40mm
Number of Levels 1
Current 8A
Contact Mating Finish Tin
Voltage - UL 300V
Number of Decks 1
Voltage - IEC 250V
Number of Ways 9
Header Orientation 90°, Right Angle
Number of Positions Per Level 9
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:2311 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.522333$3.522333
10$3.322956$33.22956
100$3.134864$313.4864
500$2.957419$1478.7095
1000$2.790018$2790.018

About 1731743

The 1731743 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 9 Pos 3.5mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1731743, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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