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1720709

1720709

1720709

Phoenix Contact

Pluggable Terminal Blocks 4 Pos 7.62mm pitch Through Hole Header

SOT-23

1720709 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 10.049991g
PackagingBulk
Published 2011
Series COMBICON PC
Feature Latch Lock
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 4
Color Green
Number of Rows 1
Gender Male
Voltage - Rated 630V
Pitch 0.300 7.62mm
Orientation Right Angle
Insulation Height 0.533 13.54mm
Current Rating41A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.165 4.19mm
Number of Levels 1
Current 41A
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 1kV
Number of Ways 4
Safety Approval UL
Header Orientation 90°, Right Angle, Under Board
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:1419 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$5.58540$279.27

About 1720709

The 1720709 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 4 Pos 7.62mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1720709, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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