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1707311

1707311

1707311

Phoenix Contact

1707311 datasheet pdf and Terminal Blocks - Headers, Plugs and Sockets product details from Phoenix Contact stock available on our website

SOT-23

1707311 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Material Copper
Housing Material Liquid Crystal Polymer (LCP)
PackagingBulk
Published 2014
Series COMBICON MCV
Feature Mounting Flange
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Color Black
Number of Rows 1
Voltage - Rated 160V
Additional FeatureLCP, UL 94V-0
HTS Code8536.69.40.40
Pitch 0.150 3.81mm
Insulation Height 0.362 9.20mm
Current Rating8A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.055 1.40mm
ELV Compliant
Number of Levels 1
Current 8A
Voltage - UL 300V
Number of Decks 1
Voltage - IEC 250V
Number of Ways 12
Safety Approval UL
Header Orientation Vertical
Number of Positions Per Level 12
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Not Applicable
In-Stock:844 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.674472$7.674472
10$7.240068$72.40068
100$6.830253$683.0253
500$6.443635$3221.8175
1000$6.078900$6078.9

1707311 Product Details

1707311 Overview


Through Hole is the mount type.The product is packaged in a Bulk case.It is part of the COMBICON MCV Series of products.Other features include LCP, UL 94V-0, to name just a few.A number of benefits can be derived from the Mounting Flange feature of this application.The part is mounted by Through Hole.There are many benefits that this part shares with other Header, Male Pins, Shrouded (4 Side) products as well.

1707311 Features


COMBICON MCV series

1707311 Applications


There are a lot of Phoenix Contact 1707311 Terminal Blocks applications.

  • Control panels
  • Industrial Automation
  • Instrumentation
  • All Electrical Machinery
  • Automotive Electronics
  • Medical technology
  • Anywhere power is distributed
  • Communication
  • Military Technology
  • Embedded systems

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