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69-11-42342-T777

69-11-42342-T777

69-11-42342-T777

Parker Chomerics

69-11-42342-T777 datasheet pdf and Thermal - Pads, Sheets product details from Parker Chomerics stock available on our website

SOT-23

69-11-42342-T777 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polymer Solder Hybrid
Shape Square
Series THERMFLOW® T777
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Shelf Life 12 Months
Adhesive Tacky - Both Sides
Shelf Life Start Date of Shipment
Outline 152.40mm x 152.40mm
Thickness 0.0045 0.115mm
RoHS StatusRoHS Compliant
In-Stock:335 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$20.25000$20.25
10$19.12500$191.25
25$18.00000$450
50$16.87500$843.75
100$15.75000$1575
250$14.62500$3656.25
500$14.34376$7171.88

About 69-11-42342-T777

The 69-11-42342-T777 from Parker Chomerics is a high-performance microcontroller designed for a wide range of embedded applications. This component features 69-11-42342-T777 datasheet pdf and Thermal - Pads, Sheets product details from Parker Chomerics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 69-11-42342-T777, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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