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T50F-C0

T50F-C0

T50F-C0

Panduit Corp

T50F-C0 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website

SOT-23

T50F-C0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount External
Package / Case 100
Material Polyethylene (PE)
Weight 2.426719kg
Operating Temperature-40°C~50°C
Series T
Published 2008
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Spiral Wrap
Max Operating Temperature50°C
Min Operating Temperature -40°C
Color Black
Type Attributes Harness
Abrasion ProtectionAbrasion Resistant
Environmental Protection Weather Resistant
Diameter 12.7mm
Length 100' 30.48m
Wall Thickness0.060 1.52mm
Diameter - Inside, Expanded 4.000 (101.60mm)
Diameter - Outside, Non-Expanded 0.500 (12.70mm)
Material Flammability Rating UL94 HB
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:73 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$235.46000$235.46
10$228.73500$2287.35
50$215.28000$10764
100$208.55250$20855.25

About T50F-C0

The T50F-C0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features T50F-C0 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T50F-C0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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