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T25F-C8

T25F-C8

T25F-C8

Panduit Corp

T25F-C8 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website

SOT-23

T25F-C8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Cable
Package / Case 100
Material Polyethylene (PE)
Weight 816.466266g
Operating Temperature-40°C~50°C
PackagingBulk
Series T
Published 2000
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Spiral Wrap
Max Operating Temperature50°C
Min Operating Temperature -40°C
Color Gray
Type Attributes Harness
Abrasion ProtectionAbrasion Resistant
Length 100' 30.48m
Width 9.5mm
Wall Thickness0.040 1.02mm
Diameter - Inside, Expanded 2.000 (50.80mm)
Diameter - Outside, Non-Expanded 0.250 (6.35mm)
Material Flammability Rating UL94 HB
REACH SVHC No SVHC
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:120 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$100.160000$100.16
10$94.490566$944.90566
100$89.142043$8914.2043
500$84.096267$42048.1335
1000$79.336101$79336.101

About T25F-C8

The T25F-C8 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features T25F-C8 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T25F-C8, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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