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T130TDMCIG

T130TDMCIG

T130TDMCIG

Panduit Corp

COVER MOLDED ELEC & SNAP GRAY

SOT-23

T130TDMCIG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case Molded
Published 2010
Series Pan-Way®
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Color Gray
Accessory Type Cover, Communication and Duplex Electrical
RoHS StatusNon-RoHS Compliant
In-Stock:2350 items

About T130TDMCIG

The T130TDMCIG from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features COVER MOLDED ELEC & SNAP GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T130TDMCIG, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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