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T130CDMCEI

T130CDMCEI

T130CDMCEI

Panduit Corp

T130 Communications And Duplex Molded Cover

SOT-23

T130CDMCEI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Package / Case Molded
Published 2010
Series Pan-Way®
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Color Ivory
Accessory Type Cover, Duplex, 1 Gang
RoHS StatusNon-RoHS Compliant
In-Stock:1967 items

About T130CDMCEI

The T130CDMCEI from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features T130 Communications And Duplex Molded Cover.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T130CDMCEI, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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