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SE125P-LR0

SE125P-LR0

SE125P-LR0

Panduit Corp

SE125P-LR0 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website

SOT-23

SE125P-LR0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Standard
Material Polyethylene Terephthalate (PET), Halogen Free
Weight 453.59237g
Operating Temperature-70°C~125°C
Series Pan-Wrap™ SE
Published 2007
Feature Noise Reduction, Vibration Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Sleeve
Color Black
Type Attributes Expandable
Abrasion ProtectionAbrasion Resistant
Environmental Protection UV Resistant
Diameter 31.75mm
Length 50.00' 15.24m
Diameter - Inside, Non-Expanded 1.250 (31.75mm)
Diameter - Inside, Expanded 1.500 (38.10mm)
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:86 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$244.839240$244.83924
10$230.980415$2309.80415
100$217.906052$21790.6052
500$205.571747$102785.8735
1000$193.935611$193935.611

About SE125P-LR0

The SE125P-LR0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features SE125P-LR0 datasheet pdf and Spiral Wrap, Expandable Sleeving product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SE125P-LR0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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