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RSCK750-X500-1

RSCK750-X500-1

RSCK750-X500-1

Panduit Corp

Copper Compression In-Line Reducing Splice Kits

SOT-23

RSCK750-X500-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
PackagingBulk
Published 2008
Series Pan-Lug®
Feature Step Up/Step Down
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
Color Black, Pink
Wire Gauge750MCM (kcmil) to 500MCM (kcmil) Flex
Insulation Fully Insulated Heat Shrink
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
RoHS StatusROHS3 Compliant
In-Stock:1709 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$70.76000$70.76

About RSCK750-X500-1

The RSCK750-X500-1 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Copper Compression In-Line Reducing Splice Kits.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RSCK750-X500-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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