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RFG5DY

RFG5DY

RFG5DY

Panduit Corp

RAISED FLOOR AIR SEALING GROMMET

SOT-23

RFG5DY Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polycarbonate (PC), Thermoplastic Vulcanizate (TPV), Vinyl Coated Fabric
Weight 635.029318g
Shape Round
Published 2008
Series Cool Boot®
Feature Electrostatic Dissipative, Flame Retardant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Color Navy
Panel Cutout Dimensions Circular - 5.000 (127.00mm)
Outside Diameter165.1 mm
Bushing, Grommet Type Grommet, Raised Floor
Diameter - Inside 4.700 (119.38mm)
Panel Thickness 0.098 2.49mm
Material Flammability Rating FAR25.853, UL94 V-0
RoHS StatusROHS3 Compliant
Flammability Rating UL94 V-0
In-Stock:115 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$90.34000$90.34
10$87.75400$877.54
25$85.17320$2129.33
50$82.59200$4129.6
100$80.01100$8001.1

About RFG5DY

The RFG5DY from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features RAISED FLOOR AIR SEALING GROMMET.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RFG5DY, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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