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KP-HSTTA

KP-HSTTA

KP-HSTTA

Panduit Corp

Dual Wall Adhesive Lined Thin Wall Heat Shrink Plastic Kit Box - Black Only

SOT-23

KP-HSTTA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Adhesive
Material Polyolefin
Weight 348.358969g
PackagingPlastic Box with Bin Guide
Published 2008
Series DAMP-SHRINK™
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Color Black
Values 47 pcs - 6 (152.4mm) lengths
Diameter 14 ea of 3/16 12 ea of 1/4 10 ea of 3/8: 6 ea of 1/2 3 ea of 3/4 2 ea of 1
RoHS StatusROHS3 Compliant
In-Stock:71 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$127.062761$127.062761
10$119.870528$1198.70528
100$113.085405$11308.5405
500$106.684344$53342.172
1000$100.645608$100645.608

About KP-HSTTA

The KP-HSTTA from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Dual Wall Adhesive Lined Thin Wall Heat Shrink Plastic Kit Box - Black Only.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the KP-HSTTA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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