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HSECFR0.5-XY

HSECFR0.5-XY

HSECFR0.5-XY

Panduit Corp

HSECFR0.5-XY datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website

SOT-23

HSECFR0.5-XY Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Wall
Material Polyolefin (PO), Rigid, Irradiated
Weight 81.646627g
Series Pan-Shrink™ WET-SHRINK™ HSECFR
Feature Adhesive Coating, Dust Tight, Flame Retardant, UV Resistant, Waterproof
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Cap
Color Black
Large Diameter Recovered0.160 (4.06mm)
Large Diameter Supplied 0.510 (12.95mm)
Total Length Supplied 2.500 63.50mm
Length 63.5mm
RoHS StatusROHS3 Compliant
In-Stock:1062 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.810000$7.81
10$7.367925$73.67925
100$6.950872$695.0872
500$6.557427$3278.7135
1000$6.186252$6186.252

About HSECFR0.5-XY

The HSECFR0.5-XY from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features HSECFR0.5-XY datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HSECFR0.5-XY, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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