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HSEC1.0-X

HSEC1.0-X

HSEC1.0-X

Panduit Corp

HSEC1.0-X datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website

SOT-23

HSEC1.0-X Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Adhesive
Insulation Material Polyolefin
Material Polyolefin (PO), Semi-Rigid, Irradiated
PackagingBulk
Series Pan-Shrink™ WET-SHRINK™ HSEC
Feature Adhesive Coating, Dust Tight, UV Resistant, Waterproof
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Cap
Color Black
Large Diameter Recovered0.449 (11.40mm)
Large Diameter Supplied 1.150 (29.21mm)
Total Length Supplied 2.800 71.12mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:583 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$10.42000$10.42
10$10.13400$101.34
25$9.85240$246.31
50$9.57100$478.55
100$9.28950$928.95
500$9.00800$4504

About HSEC1.0-X

The HSEC1.0-X from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features HSEC1.0-X datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HSEC1.0-X, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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