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HSEC0.8-X

HSEC0.8-X

HSEC0.8-X

Panduit Corp

HSEC0.8-X datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website

SOT-23

HSEC0.8-X Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Cable
Insulation Material Polyolefin
Material Polyolefin (PO), Semi-Rigid, Irradiated
Weight 79.378665g
Series Pan-Shrink™ WET-SHRINK™ HSEC
Feature Adhesive Coating, Dust Tight, UV Resistant, Waterproof
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Cap
Max Operating Temperature105°C
Min Operating Temperature -55°C
Color Black
Large Diameter Recovered0.300 (7.62mm)
Large Diameter Supplied 0.791 (20.10mm)
Total Length Supplied 1.791 45.49mm
Length 53.34mm
Diameter - Inside 20.066 mm
RoHS StatusROHS3 Compliant
In-Stock:930 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.99000$7.99
10$7.77600$77.76
25$7.56000$189
50$7.34400$367.2
100$7.12800$712.8
500$6.91200$3456

About HSEC0.8-X

The HSEC0.8-X from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features HSEC0.8-X datasheet pdf and Heat Shrink Boots, Caps product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HSEC0.8-X, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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