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H200X064H1T-B

H200X064H1T-B

H200X064H1T-B

Panduit Corp

Heat Shrink Marker ST Polyolefin White

SOT-23

H200X064H1T-B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Cable
Material Polyolefin
Weight 2.426719kg
Body Material Polyolefin
Operating Temperature-55°C~135°C
Packaging2500 per Roll
Published 2011
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color White
Label Size 2.00 x 0.64 50.8mmx16.3mm
Label Type Heat Shrinkable
Length 16.256mm
Width 50.8mm
RoHS StatusROHS3 Compliant
In-Stock:40 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About H200X064H1T-B

The H200X064H1T-B from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Heat Shrink Marker ST Polyolefin White.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H200X064H1T-B, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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