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H150X044H3T

H150X044H3T

H150X044H3T

Panduit Corp

Labels Heat Shrink Label Polyolefin Black 38.1x11.1mm

SOT-23

H150X044H3T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyolefin
Weight 612.3497g
Operating Temperature-55°C~135°C
Packaging500 per Roll
Published 2008
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color Black
Label Size 1.50 x 0.44 38.1mmx11.2mm
Label Type Heat Shrinkable
RoHS StatusROHS3 Compliant
In-Stock:59 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$456.98000$456.98

About H150X044H3T

The H150X044H3T from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Labels Heat Shrink Label Polyolefin Black 38.1x11.1mm.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H150X044H3T, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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