Welcome to Hotenda.com Online Store!

logo
userjoin
Home

H100X084H1C

H100X084H1C

H100X084H1C

Panduit Corp

Labels Heat Shrink Label Polyolefin White 21.34x25.4mm

SOT-23

H100X084H1C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyolefin
Operating Temperature-55°C~135°C
Packaging75 per Cassette
Published 2011
Series PanTher™, P1™
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color White
Label Size 1.00 x 0.84 25.4mmx21.3mm
Label Type Heat Shrinkable, Die-Cut
Height 25.4mm
RoHS StatusROHS3 Compliant
In-Stock:104 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$130.076241$130.076241
10$122.713435$1227.13435
100$115.767391$11576.7391
500$109.214520$54607.26
1000$103.032566$103032.566

About H100X084H1C

The H100X084H1C from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Labels Heat Shrink Label Polyolefin White 21.34x25.4mm.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H100X084H1C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News