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H000X064H1C

H000X064H1C

H000X064H1C

Panduit Corp

White 3/8 Diameter Heat Shrinkable Polyolefin 12 - 6 AWG

SOT-23

H000X064H1C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyolefin
Weight 244.939908g
Operating Temperature-55°C~135°C
PackagingCassette
Published 2011
Series PanTher™, P1™
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color White
Label Size 0.64 x 6.0' 16.3mmx1.8m
Label Type Heat Shrinkable, Continuous
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:140 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$69.165444$69.165444
10$65.250419$652.50419
100$61.556999$6155.6999
500$58.072641$29036.3205
1000$54.785510$54785.51

About H000X064H1C

The H000X064H1C from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features White 3/8 Diameter Heat Shrinkable Polyolefin 12 - 6 AWG.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H000X064H1C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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