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DPF18-111FIB-3K

DPF18-111FIB-3K

DPF18-111FIB-3K

Panduit Corp

Disco Grip Fully Insulated Female Disonnects

SOT-23

DPF18-111FIB-3K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Contact MaterialBrass
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Brass, Tin
PackagingTape & Reel (TR)
Published 2005
Series DiscoGrip™
Feature Butted Seam
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
Color Red
Gender Female
HTS Code8536.90.40.00
Contact Finish Tin
Wire Gauge18-22 AWG
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 18 AWG
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Diameter 0.050 ~ 0.132 (1.27mm ~ 3.35mm)
Insulation Fully Insulated
Terminal TypeStandard
Wire Cross Section 1.5 mm2
Length 18.034mm
Length - Overall 0.710 18.03mm
Tab Thickness 0.020 0.51mm
Width - Tab 0.110 2.79mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:15080 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.555544$0.555544
10$0.524098$5.24098
100$0.494432$49.4432
500$0.466445$233.2225
1000$0.440042$440.042

About DPF18-111FIB-3K

The DPF18-111FIB-3K from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Disco Grip Fully Insulated Female Disonnects.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DPF18-111FIB-3K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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