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BSV18X-MY

BSV18X-MY

BSV18X-MY

Panduit Corp

CONN SPLICE 18-22 AWG CRIMP

SOT-23

BSV18X-MY Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Insulation Material Vinyl
Weight 1.542214kg
Body Material Copper
PackagingBulk
Published 2009
Series Pan-Term®
Feature Brazed Seam
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Wire Gauge18-22 AWG
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 18 AWG
Body Plating Tin
Wire/Cable Gauge 22 AWG
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Length 26.16mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:11482 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.47000$0.47
10$0.45500$4.55
25$0.44520$11.13
50$0.43480$21.74
100$0.42440$42.44
500$0.41402$207.01

About BSV18X-MY

The BSV18X-MY from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SPLICE 18-22 AWG CRIMP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSV18X-MY, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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