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BSV18X-M

BSV18X-M

BSV18X-M

Panduit Corp

CONN SPLICE 18-22 AWG CRIMP

SOT-23

BSV18X-M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Insulation Material Vinyl
Material Copper
PackagingBulk
Published 2001
Series Pan-Term®
Feature Brazed Seam
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Reach Compliance Code compliant
Wire Gauge18-22 AWG
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 18 AWG
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Terminal Gender FEMALE
Length 26.16mm
RoHS StatusNon-RoHS Compliant
In-Stock:1937 items

About BSV18X-M

The BSV18X-M from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SPLICE 18-22 AWG CRIMP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSV18X-M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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