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BSV10X-L

BSV10X-L

BSV10X-L

Panduit Corp

CONN SPLICE 10-12 AWG CRIMP

SOT-23

BSV10X-L Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialCopper
Contact PlatingTin
Insulation Material Nylon
Material Copper
Weight 165.561215g
PackagingBulk
Published 2010
Series Pan-Term®
Feature Brazed Seam
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
Color Yellow
Orientation Straight
Wire Gauge10-12 AWG
Wire Gauge (Max) 10 AWG
Wire Gauge (Min) 12 AWG
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Length 29.972mm
RoHS StatusRoHS Compliant
In-Stock:4230 items

About BSV10X-L

The BSV10X-L from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SPLICE 10-12 AWG CRIMP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSV10X-L, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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