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BSP18-3K

BSP18-3K

BSP18-3K

Panduit Corp

Splice Terminal 16-22AWG 24.4mm 5.5mm Bulk

SOT-23

BSP18-3K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Body Material Copper
PackagingReel
Published 2005
Series Pan-Term®
Feature Brazed Seam
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Depth 5.5mm
Wire Gauge16-22 AWG
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 16 AWG
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Terminal Gender FEMALE
Length 24.4mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:18371 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About BSP18-3K

The BSP18-3K from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Splice Terminal 16-22AWG 24.4mm 5.5mm Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSP18-3K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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