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BSMV1BX-LY

BSMV1BX-LY

BSMV1BX-LY

Panduit Corp

Butt Splice Terminal 16-20AWG 26.6mm Tin

SOT-23

BSMV1BX-LY Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Weight 95.254398g
Body Material Copper
PackagingBulk
Published 2009
Series Pan-Term®
Feature Butted Seam
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Wire Gauge18-22 AWG
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 18 AWG
Body Plating Tin
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Length 26.6mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4826 items

About BSMV1BX-LY

The BSMV1BX-LY from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Butt Splice Terminal 16-20AWG 26.6mm Tin.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSMV1BX-LY, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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