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BSM1-C

BSM1-C

BSM1-C

Panduit Corp

Terminals Metric Butt Splice non-insulated, 0.5

SOT-23

BSM1-C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Weight 90.718474g
Body Material Copper
PackagingBulk
Published 2007
Series Pan-Term®
Feature Brazed Seam
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
ECCN Code EAR99
HTS Code8536.90.40.00
Depth 3.3mm
Wire Gauge18-20 AWG
Wire Gauge (Max) 20 AWG
Wire Gauge (Min) 18 AWG
Body Plating Tin
Terminal and Terminal Block Type WIRE TERMINAL
Insulation Non-Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Terminal Gender FEMALE
Length 15.7mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4992 items

About BSM1-C

The BSM1-C from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Terminals Metric Butt Splice non-insulated, 0.5.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSM1-C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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