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ERJSUT08F5762V

ERJSUT08F5762V

ERJSUT08F5762V

PANASONICELECTRONICCOMPONENTS

ERJSUT08F5762V datasheet pdf and Boxes product details from PANASONICELECTRONICCOMPONENTS stock available on our website

SOT-23

ERJSUT08F5762V Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time NRND (Last Updated: 1 week ago)
Lifecycle Status 2 Weeks
Mount Through Hole
Mounting Type Surface Mount
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 3
Operating Temperature -55°C ~ 150°C
Packaging Bulk
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Operational Amplifier
Voltage - Supply 20V ~ 50V
Base Part Number Apba Ptnsui
Output Voltage 58 V
Output Type -
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1.5 mA
Nominal Supply Current 1 μA
Output Current 10 mA
Max Supply Current 1 mA
Slew Rate 0.6V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:2524 items

About ERJSUT08F5762V

The ERJSUT08F5762V from PANASONICELECTRONICCOMPONENTS is a high-performance microcontroller designed for a wide range of embedded applications. This component features ERJSUT08F5762V datasheet pdf and Boxes product details from PANASONICELECTRONICCOMPONENTS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ERJSUT08F5762V, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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