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ELJ-PA6R8MF2

ELJ-PA6R8MF2

ELJ-PA6R8MF2

Panasonic Electronic Components

Ind Power Chip Molded Wirewound 6.8uH 20% 7.96MHz 7Q-Factor Ferrite 620mA 1210 T/R

SOT-23

ELJ-PA6R8MF2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1210 (3225 Metric)
Material - Core Ceramic
Operating Temperature-20°C~85°C
PackagingCut Tape (CT)
Published 2013
Series PA2
Size / Dimension 0.126Lx0.098W 3.20mmx2.50mm
Tolerance ±20%
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Packing Method TR
Shielding Unshielded
Construction Molded Chip
Reach Compliance Code unknown
Current Rating620mA
Case Code (Metric) 3225
Case Code (Imperial) 1210
Inductance 6.8μH
Test Frequency1MHz
DC Resistance (DCR) 280mOhm
Max DC Current 620mA
Frequency - Self Resonant 28MHz
Current - Saturation 530mA
Height Seated (Max) 0.094 2.40mm
RoHS StatusRoHS Compliant
In-Stock:3221 items

About ELJ-PA6R8MF2

The ELJ-PA6R8MF2 from Panasonic Electronic Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ind Power Chip Molded Wirewound 6.8uH 20% 7.96MHz 7Q-Factor Ferrite 620mA 1210 T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ELJ-PA6R8MF2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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