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RFP30N06LE

RFP30N06LE

RFP30N06LE

ON Semiconductor

RFP30N06LE datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

RFP30N06LE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-220-3
Number of Pins 3
Supplier Device Package TO-220-3
Operating Temperature-55°C~175°C TJ
PackagingTube
Published 2002
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Through Hole
Max Operating Temperature175°C
Min Operating Temperature -55°C
Voltage - Rated DC 60V
Technology MOSFET (Metal Oxide)
Current Rating30A
Lead Pitch 2.54mm
Number of Elements 1
Power Dissipation-Max 96W Tc
Element ConfigurationSingle
Power Dissipation96W
FET Type N-Channel
Rds On (Max) @ Id, Vgs 47mOhm @ 30A, 5V
Vgs(th) (Max) @ Id 2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1350pF @ 25V
Current - Continuous Drain (Id) @ 25°C 30A Ta
Gate Charge (Qg) (Max) @ Vgs 62nC @ 10V
Rise Time88ns
Drain to Source Voltage (Vdss) 60V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +10V, -8V
Fall Time (Typ) 40 ns
Turn-Off Delay Time 30 ns
Continuous Drain Current (ID) 30A
Threshold Voltage 2V
Gate to Source Voltage (Vgs) 10V
Drain to Source Breakdown Voltage 60V
Dual Supply Voltage 60V
Input Capacitance1.35nF
Drain to Source Resistance 47mOhm
Rds On Max 47 mΩ
Nominal Vgs 2 V
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:3229 items

RFP30N06LE Product Details

RFP30N06LE Description

The RFP30N06LE is a MegaFET N-Channel power MOSFET with a channel length of 30nm. This method, which employs feature sizes that are similar to those found in LSI integrated circuits, allows for the most efficient use of silicon, resulting in exceptional performance.


RFP30N06LE Features

  • 30A, 60V

  • rDS(ON) = 0.047?

  • 2kV ESD Protected

  • Temperature Compensating PSPICE? Model

  • Peak Current vs Pulse Width Curve

  • UIS Rating Curve

  • Related Literature - TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”


RFP30N06LE Applications

  • Switching regulators

  • Switching converters

  • Motor drives

  • Relay drivers

  • Power management

  • Audio amplifiers


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