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FJN3303RBU

FJN3303RBU

FJN3303RBU

ON Semiconductor

TRANS PREBIAS NPN 300MW TO92-3

SOT-23

FJN3303RBU Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 36 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-226-3, TO-92-3 (TO-226AA)
Number of Pins 3
PackagingBulk
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature150°C
Min Operating Temperature -55°C
Voltage - Rated DC 50V
Max Power Dissipation300mW
Current Rating100mA
Base Part Number FJN3303
Polarity NPN
Element ConfigurationSingle
Power Dissipation300mW
Transistor Type NPN - Pre-Biased
Collector Emitter Voltage (VCEO) 50V
Max Collector Current 100mA
DC Current Gain (hFE) (Min) @ Ic, Vce 56 @ 5mA 5V
Current - Collector Cutoff (Max) 100nA ICBO
Vce Saturation (Max) @ Ib, Ic 300mV @ 500μA, 10mA
Collector Emitter Breakdown Voltage50V
Frequency - Transition 250MHz
Emitter Base Voltage (VEBO) 10V
hFE Min 56
Resistor - Base (R1) 22 k Ω
Continuous Collector Current 100mA
Resistor - Emitter Base (R2) 22 k Ω
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:3261 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.159441$0.159441
10$0.150415$1.50415
100$0.141902$14.1902
500$0.133869$66.9345
1000$0.126292$126.292

About FJN3303RBU

The FJN3303RBU from ON Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS PREBIAS NPN 300MW TO92-3.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FJN3303RBU, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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