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FDMC8200

FDMC8200

FDMC8200

ON Semiconductor

FDMC8200 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDMC8200 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 23 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact PlatingGold
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerWDFN
Number of Pins 8
Weight 186mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Series PowerTrench®
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 20MOhm
Subcategory FET General Purpose Power
Max Power Dissipation900mW
Terminal FormNO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Qualification StatusNot Qualified
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation2.2W
Case Connection DRAIN-SOURCE
Power - Max 700mW 900mW
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 20m Ω @ 6A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 660pF @ 15V
Current - Continuous Drain (Id) @ 25°C 8A 12A
Gate Charge (Qg) (Max) @ Vgs 10nC @ 10V
Rise Time4ns
Fall Time (Typ) 6 ns
Turn-Off Delay Time 38 ns
Continuous Drain Current (ID) 8A
Threshold Voltage 2.3V
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 8A
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 40A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 2.3 V
Feedback Cap-Max (Crss) 30 pF
Turn On Time-Max (ton) 30ns
Height 750μm
Length 3mm
Width 3mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:5845 items

Pricing & Ordering

QuantityUnit PriceExt. Price

FDMC8200 Product Details

FDMC8200 Description

The device includes two dedicated N-channel MOSFET in a dual Power33 (3 Mm X 3 Mm MLP) package. The switch nodes are connected internally for easy placement and wiring of synchronous step-down converters. Control MOSFET (Q1) and synchronous MOSFET (Q2) are designed to provide optimal power efficiency.


FDMC8200 Features

Q1: N-Channel

Max. RDS(on) = 20 mΩ at VGS = 10 V, ID = 6A

Max. RDS(on) = 32 mΩ at VGS = 4.5 V, ID = 5A

Q2: N-Channel

Max. RDS(on) = 9.5 mΩ at VGS = 10 V, ID = 9A

Max. RDS(on) = 13.5 mΩ at VGS = 4.5 V, ID = 7A

RoHS Compliant


FDMC8200 Applications


This product is general usage and suitable for many different applications.



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