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FDG6320C

FDG6320C

FDG6320C

ON Semiconductor

FDG6320C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDG6320C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Number of Pins 6
Weight 28mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2017
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Termination SMD/SMT
ECCN Code EAR99
Resistance 4Ohm
Additional FeatureLOGIC LEVEL COMPATIBLE
Subcategory Other Transistors
Max Power Dissipation300mW
Terminal FormGULL WING
Current Rating220mA
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation300mW
Turn On Delay Time5 ns
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 4 Ω @ 220mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 9.5pF @ 10V
Current - Continuous Drain (Id) @ 25°C 220mA 140mA
Gate Charge (Qg) (Max) @ Vgs 0.4nC @ 4.5V
Rise Time8ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 8 ns
Turn-Off Delay Time 9 ns
Continuous Drain Current (ID) 220mA
Threshold Voltage 850mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 25V
Dual Supply Voltage 25V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate
Height 1.1mm
Length 2mm
Width 1.25mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:15698 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$41.878000$41.878
10$39.507547$395.07547
100$37.271271$3727.1271
500$35.161576$17580.788
1000$33.171298$33171.298

FDG6320C Product Details

FDG6320C Description


These dual N & P-Channel logic level enhancement mode field effect transistors are produced using a proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for bipolar digital transistors and small signal MOSFETS. Since bias resistors are not required, this dual digital FET can replace several different digital transistors, with different bias resistor values.

FDG6320C Features

N-Ch 0.22 A, 25 V,

RDS(ON) = 4.0 |? @ VGS= 4.5 V,

RDS(ON) = 5.0 |? @ VGS= 2.7 V.

P-Ch -0.14 A, -25 V,

RDS(ON) = 10 |? @ VGS= -4.5 V,

RDS(ON) = 13 |? @ VGS= -2.7 V.

Very small package outline SC70-6.

Very low level gate drive requirements allowing direct operation in 3 V circuits (VGS(th) < 1.5 V).

Gate-Source Zener for ESD ruggedness (>6kV Human Body Model).


FDG6320C Applications


This product is general usage and suitable for many different applications.


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