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FDG330P

FDG330P

FDG330P

ON Semiconductor

FDG330P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDG330P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 48 Weeks
Lifecycle Status LAST SHIPMENTS (Last Updated: 2 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Number of Pins 6
Weight 28mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2001
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish Tin (Sn)
Subcategory Other Transistors
Voltage - Rated DC -12V
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal FormGULL WING
Current Rating-2A
Number of Elements 1
Power Dissipation-Max 750mW Ta
Element ConfigurationSingle
Operating ModeENHANCEMENT MODE
Power Dissipation750mW
Turn On Delay Time10 ns
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 110m Ω @ 2A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 477pF @ 6V
Current - Continuous Drain (Id) @ 25°C 2A Ta
Gate Charge (Qg) (Max) @ Vgs 7nC @ 4.5V
Rise Time11ns
Drain to Source Voltage (Vdss) 12V
Drive Voltage (Max Rds On,Min Rds On) 1.8V 4.5V
Vgs (Max) ±8V
Fall Time (Typ) 11 ns
Turn-Off Delay Time 12 ns
Continuous Drain Current (ID) 2A
Threshold Voltage -700mV
Gate to Source Voltage (Vgs) 8V
Drain Current-Max (Abs) (ID) 2A
Drain to Source Breakdown Voltage -12V
Height 1mm
Length 2mm
Width 1.25mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:21278 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.34000$0.34
500$0.3366$168.3
1000$0.3332$333.2
1500$0.3298$494.7
2000$0.3264$652.8
2500$0.323$807.5

FDG330P Product Details

FDG330P Description


Fairchild's innovative low voltage PowerTrench technology is used in this P-Channel 1.8V specified MOSFET. It's been designed with battery power management in mind. Lowering conduction loss, improving switching performance, increasing dv/dt rate, and increasing avalanche energy are all goals of this technology.



FDG330P Features


Rqs(on)= 110 m£2 @ Vgs = -4.5 V

@ Vqs = —2.5 V, Rds(on)= 150

@ Vgs = —1 -8 V, Rds(on)= 215 mQ

Low entry fee

Extremely low Rqsioni with high-performance trench technology

SC70-6 surface mount package is a compact industry standard.



FDG330P Applications


?Battery administration


?Turn on the load switch


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