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5602E

5602E

5602E

Ohmite

KNOB SMOOTH 0.250" PLASTIC

SOT-23

5602E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Package / Case Molded
Surface MountYES
Terminal Shape WRAPAROUND
Mounting FeatureSURFACE MOUNT
Material Plastic
Published 2010
Series MMC
Tolerance 5%
JESD-609 Code e3
Feature 8-32 Set Screw
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
Temperature Coefficient100 ppm/°C
Type Smooth
Resistance 56000Ohm
Terminal Finish Matte Tin (Sn)
Color Black
Subcategory Fixed Resistors
Packing Method TR, PAPER
Technology METAL GLAZE/THICK FILM
Construction Chip
Style Cylindrical with Pointer
Rated Power Dissipation (P) 0.25W
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Working Voltage 400V
Size Code 1206
Rated Temperature 70°C
IndicatorLine on Top and Side
Shaft Size 0.250 6.35mm
Diameter 1.219 30.96mm
Height 0.625 15.88mm
REACH SVHC Unknown
RoHS StatusROHS3 Compliant
In-Stock:2164 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.265122$4.265122
10$4.023700$40.237
100$3.795944$379.5944
500$3.581078$1790.539
1000$3.378376$3378.376

About 5602E

The 5602E from Ohmite is a high-performance microcontroller designed for a wide range of embedded applications. This component features KNOB SMOOTH 0.250" PLASTIC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5602E, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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