OSD32MP157C-512M-BAA Description
The OSD32MP157C-512M-BAA System-in-Package (SiP) device delivers all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP157C-512M-BAA has the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4. Along with the processor, the OSD32MP157C-512M-BAA integrates up to 1GB of DDR3L, STPMIC1 Power Management IC, EEPROM, MEMsOscillator, and passives into a single easy-to-use BGA package.
OSD32MP157C-512M-BAA Features
ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillatorandpassive components integrated into a single package
Arm®Cortex®-A7up to 800MHzx2
Arm® Cortex®-M4 up to 209MHz
NEON™SIMD Coprocessor x2
Arm® TrustZone®
USB 2.0 HS + PHY x2
Ethernet 10/100/1000
CANFD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6,I2S x3, QSPI x2
eMMC/SD/SDIO Ports x3
GPIO x148
24-bit RGB Display, MIPI DSI
Camera Interface
22 Channel 16-bit ADC x2, 12-bit DAC x2
OSD32MP157C-512M-BAA Applications
Microwave ovens
Traffic lights
