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XPC850DEVR66BUR2

XPC850DEVR66BUR2

XPC850DEVR66BUR2

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BBGA

SOT-23

XPC850DEVR66BUR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BBGA
Operating Temperature0°C~95°C TA
PackagingTape & Reel (TR)
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS StatusROHS3 Compliant
In-Stock:3691 items

XPC850DEVR66BUR2 Product Details

XPC850DEVR66BUR2 Overview


With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~95°C TA. A MPC8xx series item. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PC850.

XPC850DEVR66BUR2 Features




XPC850DEVR66BUR2 Applications


There are a lot of NXP USA Inc.
XPC850DEVR66BUR2 Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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