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XPC850CZT66BU

XPC850CZT66BU

XPC850CZT66BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BGA

SOT-23

XPC850CZT66BU Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BGA
Operating Temperature-40°C~95°C TA
PackagingTray
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS StatusNon-RoHS Compliant
In-Stock:2330 items

XPC850CZT66BU Product Details

XPC850CZT66BU Overview


The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~95°C TA is determined. This is a member of the MPC8xx series. A CPU with this architecture uses DRAM RAM controllers. With its HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use PC850 when searching for variants of the embedded microprocessor.

XPC850CZT66BU Features




XPC850CZT66BU Applications


There are a lot of NXP USA Inc.
XPC850CZT66BU Microprocessor applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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