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TWR-MPC8309

TWR-MPC8309

TWR-MPC8309

NXP USA Inc.

Silicon Manufacturer:NXP; Core Architecture:Power Architecture; Core Sub-Architecture:PowerQUICC; Silicon Core Number:MPC8309; Silicon Family Name:PowerQUICC II PRO; No. of Bits:32bit ;RoHS Compliant:

SOT-23

TWR-MPC8309 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mounting Type Fixed
Published 2004
Series PowerQUICC II™ PRO
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type MPU
Core Processor e300
Utilized IC / Part MPC8309
Contents Board(s), Cable(s)
Board Type Evaluation Platform
Platform Tower System
RoHS StatusROHS3 Compliant
In-Stock:76 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$238.00000$238

About TWR-MPC8309

The TWR-MPC8309 from NXP USA Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Silicon Manufacturer:NXP; Core Architecture:Power Architecture; Core Sub-Architecture:PowerQUICC; Silicon Core Number:MPC8309; Silicon Family Name:PowerQUICC II PRO; No. of Bits:32bit ;RoHS Compliant:.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TWR-MPC8309, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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