SSTUA32S865ET,557 Overview
As a packaging method, Tray is used.The 160-TFBGA package contains it.To ensure normal operation of the device, 1.7V~2V is supplied.A Surface Mount mounting method is used for mounting electronic parts.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 28 bits.Based on its base part number 74SSTUA32S865, related parts can be found.All component pins add up to 160.The 160 terminations prevent signals from reflecting off the end of the transmission line.The subcategory Other Logic ICs can include it.Maintaining the power supply of 1.8V is necessary for convenient operation.
SSTUA32S865ET,557 Features
SSTUA32S865ET,557 Applications
There are a lot of NXP USA Inc.
SSTUA32S865ET,557 Specialty Logic ICs applications.
- Cell phones
- Wireless modems
- Remote controls
- Wireless network systems
- Satellite communications networks
- Ethernet circuitry
- Wired telephone
- Cordless telephone
- Desktop PC
- Notebook