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SPC5777CCK3MMO3

SPC5777CCK3MMO3

SPC5777CCK3MMO3

NXP USA Inc.

8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 516-BGA

SOT-23

SPC5777CCK3MMO3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 516-BGA
Surface MountYES
Operating Temperature-40°C~125°C TA
PackagingTray
Published 2012
Series MPC57xx
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516
ECCN Code 5A992
Additional FeatureALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.
HTS Code8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B516
Supply Voltage-Max (Vsup) 1.32V
Supply Voltage-Min (Vsup) 1.2V
Oscillator TypeInternal
Speed 264MHz
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z7
Peripherals DMA, LVD, POR, Zipwire
Clock Frequency 40MHz
Program Memory TypeFLASH
Core Size 32-Bit Tri-Core
Program Memory Size 8MB 8M x 8
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Bit Size 32
Data Converter A/D 16b Sigma-Delta, eQADC
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
ROM (words) 8388608
On Chip Program ROM Width 8
RAM (bytes) 524288
Height Seated (Max) 2.02mm
Length 27mm
Width 27mm
RoHS StatusROHS3 Compliant
In-Stock:135 items

Pricing & Ordering

QuantityUnit PriceExt. Price
200$39.59950$7919.9

SPC5777CCK3MMO3 Product Details

SPC5777CCK3MMO3 Features

On-chip modules available within the family include the following features:

Three dual issue, 32-bit CPU core complexes (e200z7), two of which run in lockstep

Power Architecture embedded specification compliance

Instruction set enhancement allowing variable length encoding (VLE), optional

encoding of mixed 16-bit and 32- bit instructions, for code size footprint

reduction

On the two computational cores: Signal processing extension (SPE1.1)

instruction support for digital signal processing (DSP)

Single-precision floating point operations

On the two computational cores: 16 KB I-Cache and 16 KB D-Cache

Hardware cache coherency between cores

16 hardware semaphores

3-channel CRC module

8 MB on-chip flash memory

Supports read during program and erase operations, and multiple blocks

allowing EEPROM emulation

512 KB on-chip general-purpose SRAM including 64 KB standby RAM

Two multichannel direct memory access controllers (eDMA)

64 channels per eDMA

Dual core Interrupt Controller (INTC)

Dual phase-locked loops (PLL s) with stable clock domain for peripherals and

frequency modulation (FM) domain for computational shell

Crossbar Switch architecture for concurrent access to peripherals, flash memory, or

RAM from multiple bus masters with End-To- End ECC

External Bus Interface (EBI) for calibration and application use

System Integration Unit (SIU)

Error Injection Module (EIM) and Error Reporting Module (ERM)

Four protected port output (PPO) pins

Boot Assist Module (B AM) supports serial bootload via CAN or SCI

Three second-generation Enhanced Time Processor Units (eTPUs)

32 channels per eTPU

Total of 36 KB code RAM

Total of 9 KB parameter RAM



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